membrane panels

Waterproof Gloss PC Embossed Membrane Switch Graphic Overlay For Apparatuses

Quick Detail:

Description:

The main technical indicators

1. Max size: single sided, double sided:600mm * 500mm 　Multi-layer: 400mm * 600mm
2. Processing thickness:0.2mm -4.0mm

3 Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ )
4 Common material: FR-4 , CEM-3 , CEM-1, Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HAL；Immersion Gold,Antioxidant,HASL,Immersion Tin,etc.

Process Capability

1. Drilling:The minimum diameter 0.1mm

2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture ratio 4:1

3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm

4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm

5. Gold plate: nickel layer thickness:≧2.5μ,Gold layer thickness: 0.05-0.1μm or according to customer requirements

6. HASL: tin layer thickness:≧2.5-5μ

7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.15mm smallest form tolerance: ± 0.1mm

8. Socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth: 1-3mm

9. V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth: thickness 2/3 Minimum size: 80mm * 80mm

Applications:

1. The mobile phone

Focuses on the flexible circuit board light weight and thin thickness. Can effectively save the volume of products, easy connection of the battery, microphone, and buttons and into one.

2. Computer and LCD screen

Use the one line configuration of flexible circuit boards, and thin thickness. The digital signal into the picture, through the LCD screen

3. CD player

Focuses on three dimensional assembly characteristics of flexible circuit boards and thin thickness. The huge CD to carry around

4. Disk drives

Regardless of the hard disk, or diskette, is very dependent on FPC high softness and thickness of the 0.1 mm slim, read data finish quickly. Either a PC or NOTEBOOK.

5. The latest applications

Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su ensi. N cireuit) and the components of xe packaging board, etc

Specifications